Higher Profile for CSMA - 3D Non-Contact Profiling (3DP)

CSMA has recently expanded its range of characterisation techniques with the installation of a MicroXAM 3D surface profiler from ADE-Phase Shift in Arizona, USA.

The MicroXAM uses white light interferometry to provide quantitative assessment of shape, texture and topography, all of which critically affect form, fit and function of products.

In recent years, 3DP has become an increasingly important part of CSMA’s problem solving capabilities, its ability to quantify physical aspects of materials superbly complementing our range of surface chemical characterization techniques. Specimen area sizes ranging from tens of mm to microns can be analysed with sub-nm height resolution.

The range of surfaces analysed typically include semiconductor devices, wafers, paper, plastics, ceramics, pharmaceuticals, medical devices and metals.

MicroXAM is also configured for the routine measurement of layer thickness including coatings on stents.

Our clients have found 3DP an extremely effective tool in product development, production and field failure analysis and product claim support.

CSMA contact:
Alan Brown
Tel +44 (0)1782 764269
E-mail alan.brown@ceram.com